Power chips are linked to exterior circuits with packaging, and their efficiency depends on the support of the packaging. In high-power circumstances, power chips are normally packaged as power modules. Chip affiliation refers to the electric connection on the top surface area of the chip, which is normally aluminum bonding cable in standard modules. ^
Conventional power module package cross-section
Currently, industrial silicon carbide power modules still mostly make use of the product packaging modern technology of this wire-bonded typical silicon IGBT module. They face problems such as huge high-frequency parasitic specifications, insufficient warm dissipation capacity, low-temperature resistance, and inadequate insulation toughness, which limit using silicon carbide semiconductors. The display of excellent performance. In order to address these problems and completely make use of the massive prospective advantages of silicon carbide chips, many new packaging innovations and solutions for silicon carbide power modules have arised in the last few years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually developed from gold cable bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually created from gold cables to copper wires, and the driving pressure is price reduction; high-power devices have established from aluminum cords (strips) to Cu Clips, and the driving pressure is to boost product performance. The greater the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to connect chips and pins. Compared with traditional bonding packaging approaches, Cu Clip modern technology has the adhering to advantages:
1. The connection between the chip and the pins is made from copper sheets, which, to a specific level, replaces the conventional cable bonding technique in between the chip and the pins. Consequently, an unique package resistance worth, higher present circulation, and better thermal conductivity can be obtained.
2. The lead pin welding area does not need to be silver-plated, which can completely conserve the cost of silver plating and bad silver plating.
3. The item appearance is entirely consistent with typical products and is primarily made use of in servers, mobile computers, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both eviction pad and the Source pad are clip-based. This bonding method is a lot more expensive and complex, yet it can attain far better Rdson and better thermal effects.
( copper strip)
Copper sheet plus cord bonding technique
The source pad makes use of a Clip method, and eviction makes use of a Cable technique. This bonding method is a little more affordable than the all-copper bonding technique, conserving wafer area (suitable to extremely small gateway areas). The process is less complex than the all-copper bonding technique and can acquire much better Rdson and better thermal impact.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding tellurium copper, please feel free to contact us and send an inquiry.
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